The International Solid-State Circuits Conference (ISSCC, http://isscc.org/) is the world’s premier meeting for integrated-circuit design. Since 2009 a member of the staff of DICE has been nominated for the Technical Program Committee (TPC), which is the governing body selected out of industrial and academic professionals in this field and demonstrates the high international reputation of the DICE in the wireless circuit design area.

In 2009 a member of the DICE has also taken part in the Wireless Forum at the ISSCC, giving a presentation titled “Multi-Standard Radios for 2G and 3G”, detailing the challenges for 2G/3G radios and presenting possible solutions for efficient RF platforms and advanced dual-standard cellular transceivers with high integration level.