DICE

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About

DICE is a dynamic and fast-growing company in the field of microelectronics with a strong focus on research and development. We design innovative, leading-edge Application-Specific Integrated Circuits(ASICs) for the communications industry, with particular emphasis on wireless products.

Experiential Learning

DigRF [DIP.DR.030]
Introduction DigRF	Key Features	Block Diagram	Details


Key Features
One LVDS pair for uplink and one for downlink (capable of Rx 3G diversity for up to 2 antenna paths) Uplink data-rates 6.5 Mbit/s low speed (startup/fallback, Tx 2.5G data) 312 Mbit/s high speed (3G / 2.5G Tx data) Downlink data-rates 6.5 Mbit/s low speed (startup/fallback) 26 Mbit/s medium speed (Rx 2.5G data) 312 Mbit/s high speed (3G / 2.5G Rx data) Data rate for uplink and downlink can be adjusted independently Multiplexed data / control path for maximum pin efficiency Support of power optimized system design through implementation of sleep modes Phase correlator for reliable receive path synchronization between RF IC and baseband IC Integrated interface test modes (clock test, loopback mode, ping response) Support of CTS (clear to send) mechanism

Contact

DICE GmbH & Co KG

Freistädter Straße 400
4040 Linz / Austria

Phone: +43 (0)5 1777 15110 Fax: +43 (0)5 1777 15999

email: office@dice.at

How to find us

Jobs

DICE is a rapidly growing

company based on values of excellence and shared responsibility, where individuality and teamwork join forces.

We offer an activity-related salary, a modern workplace, flexible work time and a con- genial working atmosphere